gbu602 thru gbu610 glass passivated bridge rectifier reverse voltage - 200 to 1000 volts forward current - 6.0 amperes features mechanical data case : molded plastic terminals : tin plated, solderable per mil-std-750, method 2026 polarity : as marked on body weight : 4.0 grams (approx) maximum ratings and electrical characteristics ratings at 25 o c ambient temperature unless otherwise specified. maximum repetitive peak reverse voltage symbols v rrm units volts maximum rms voltage v rms volts maximum dc blocking voltage v dc gbu602 200 140 200 gbu604 400 280 400 gbu606 600 420 600 GBU608 800 560 800 gbu610 1000 700 1000 volts maximum instantaneous forward voltage at 3.0 a v f 1.0 volts peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm 175 amps maximum dc reverse current at rated dc blocking voltage @t a =25 o c @t a =125 o c i r 5 500 ua zowie technology corporation rev. 0 operating junctionstorage temperature range t j, t stg -55 to +150 o c typical junction capacitance per element (note 4) c j 50 pf typical thermal resistance per leg (note 3) 7.4 2.2 o c / w r ja r jc amps maximum average forward rectified current )t c =100 o c (note1,2) i (av) 6.0 *dimensions in inches and (millimeters) polarity shown on front side of case, positive lead by beveled corner gbu 0.878 (22.30) 0.854 (21.70) 0.118 (3.0) x 45 o chamfer 0.224 (5.70) 0.209 (5.30) 0.728 (18.50) 0.689 (17.50) 0.142 (3.6) 0.146 (3.70) 0.130 (3.30) 0.740 (18.80) 0.717 (18.20) 0.311 (7.20) 0.268 (6.80) 0.098 (2.50) 0.059 (1.50) 0.047 (1.20) 0.031 (0.80) 0.103 (2.61) 0.087 (2.21) 0.208(5.28) 0.192(4.88) 0.208(5.28) 0.192(4.88) 0.208(5.28) 0.192(4.88) 0.053 (1.34) 0.037 (0.94) 0.028 (0.70) 0.012 (0.30) * glass passivated chip junctions * compliance to rohs product * plastic material has underwriters laboratory flammability classification 94v-0 * high surge current capability * ideal for printed circuit boards * high temperature soldering guaranteed : 260 o c/10 seconds notes : (1) unit case mounted on al plate heat-sink (2) unit mounted on p.c.b. without heat-sink (3) recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 screw heat-sink size : 6.35 x 3.5 x 0.15cm) (4) measured at 1.0mhz and applied reverse voltage of 4.0v dc.
ratings and characteristic curves gbu602 thru gbu610 zowie technology corporation rev. 0 fig.1 - forward current derating curve fig.3 - typical instantaneous forward characteristics average forward rectified current, amperes 8.0 6.0 2.0 4.0 iinstantaneous forward current, amperes 0.1 1.0 10.0 100.0 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 0 25 50 75 100 125 150 pulse width=300us 1% duty cycle case temperature, o c instantaneous forward voltage, volts 60 hz resistive or inductive load fig.2 - maximum non-repetitive peak forward surge current peak forward surge current, amperes number of cycles at 60hz pulse width 8.3ms single half-sire-wave (jedec method) 0 25 50 75 100 175 200 150 125 1 10 100 heat-sink mounted 2.6 x 1.4 x 0.06" thick (6.5 x 3.5 x 0.15 cm) al. plate fig.5 - typical junction capacitance reverse voltage, volts junction capacitance, pf fig.6 - typical transient thermal impedance t, heating time, sec. transient thermal impedance, o c / w 0.1 0.01 1.0 10 100 10 1 0.1 100 tj=25 o c fig.4 - typical reverse characteristics per bridge element percent of rated peak reverse voltage,% instantaneous reverse current, microamperes 0.01 0 0.10 1.0 10 100 500 20 40 60 80 100 tj=25 o c tj=125 o c gbu602 & gbu604 gbu606 ~ gbu610 t j =25 o c .1 1 40 200 .2 .4 1.0 2 4 10 20 40 100 2 4 10 6 20 60 100
|
